KSNB – Self-temperature-compensating semiconductor strain gages
(Gage-factor: -100)
Order on request
These products are requested only from ZSE. Our employees will contact you as soon as possible with an offer.
Order on request
This product is ordered on request!
An account at myZSE gives you the opportunity to order this product directly.
Die KSNB-Halbleiter-DMS arbeiten mit n-Silizium, dessen Temperaturkoeffizient des Widerstands vom Hersteller an den linearen Wärmeausdehnungskoeffizient des Messobjektwerkstoffs angepasst werden kann. Sie zeichnen sich durch extrem kleine Temperaturabhängigkeit ihres Widerstands aus.
Specifications
- Gage-Factor
-
-100
- Materials Resistive element
-
N type Si
- Materials Base
-
Paper base + phenol-epoxy
- Compensated Temperature Range
-
20 –
70
°C
- Applicable linear expansion coefficient
-
11,16
- Strain limit at room temp.
-
0.3
%
- Fatigue lives at normal temperature (times)
-
2x106
times
- Safe Temperature Range
-
-50 –
150
°C
- Operating temperature range in combination with major adhesives after curing
-
CC-33A: -50 to 120 ºC
CC-36: -30 to 100 ºC
EP-17 for E5: -50 to 120
°C
D
CC-33A-5
Suitable for bonding general-purpose gages which are used for general stress
measurement at normal temperature, quick curing.
Request
S
CC-33A-5
Suitable for bonding general-purpose gages which are used for general stress
measurement at normal temperature, quick curing.
Instantaneous strain gage adhesive cured at normal temperature.
Operating Temperature: -196 .. 120 °C
Metals (Steel, stainless steel, copper, aluminum alloys A1050, A2024, etc.)
Plastics (Acrylate, PVC, nylon, etc.)
Composite materials (CFRP, GFRP, PCB, etc.)
Rubber
5 tubes á 2 grams
S
D
CC-36-5
Instantaneous adhesive cured at normal temperatures for bonding a high-elonation gages
Request
S
CC-36-5
Instantaneous adhesive cured at normal temperatures for bonding a high-elonation gages
- Suitable for bonding a high-elonation gage such as KFEM and KFEL at normal temperatures of 20 to 80°C
- Suitable for bonding to hard-to-bond materials such as aluminum alloy (A7075) and magnesium alloy
- High peeling resistance, high impact resistance and less aging deteriotation of bonding strength
- Strong bonding power to hard-to-bond materials
- Curing time is longer than CC-33A
- Operating Temperature: -30 to 100°C
Main material:
- Metals (Steel, stainless steel, copper, aluminum alloys A1050/A2024/A7075, magnesium alloy, etc.)
- Plastics (acrylate, vinyl chloride, nylon, polypropylene, etc.)
- Composite materials (CFRP, GFRP, printed board, etc.)
- Concrete
- Mortar
- Lumber
- Rubber
S
D
EP-340
Suitable for bonding gages for strain measurement at middle temperatures
Request
S
EP-340
Suitable for bonding gages for strain measurement at middle temperatures
- Cured at normal temperatures or by heating
- Operating Temperature -55 to 150°C
- Ingredients 2 types of liquid mixed
- Content 30 g (Main agent: 6 g × 4, Curing agent: 1.5 g × 4)
- Main material: Metals (Iron, stainless steel, aluminum alloy, etc.)
S