KSPH Series
Order on request
These products are requested only from ZSE. Our employees will contact you as soon as possible with an offer.
Order on request
This product is ordered on request!
An account at myZSE gives you the opportunity to order this product directly.
Die KSPH-Halbleiter-DMS besitzen einen besonders hohen Widerstand und ermöglichen damit hohe Brückenausgangsspannungen bei der Anwendung hoher Brückenspeisespannungen.
Specifications
- Materials Resistive element
-
P type Si
- Materials Base
-
Paper base and phenol-epoxy
- Operating temperature in combination with major adhesives after curing
-
CC-33A: -50 to 120 ºC
CC-36: -30 to 100 ºC
°C
- Operating temperature in combination with major leadwire cables
-
Silver-clad copper wires : -50 to 150 ºC
°C
- Strain limit at room temp.
-
0.3
%
- Fatigue lives at normal temperature (times)
-
2x106
timesI
- Materials Base
-
Paper base + phenol-epoxy
- Gitterform
-
E4
- Fatigue lives at normal temperature (times)
-
2x106 (±1000μm/m)
times
- k-Faktor
-
170
- Materials Resistive element
-
P type Si
- Strain limit at room temp.
-
0.3
%
- Stück pro Packung
-
4
Stück
- Safe Temperature Range
-
-50 –
150
°C
- Operating temperature range in combination with major adhesives after curing
-
CC-33A: -50 to 120ºC
CC-36: -30 to 100ºC
°C
KSPH Uniaxial
(2000 & 10000 Ohm)
Products
We have many DMS in stock. For express delivery, please contact us by telephone.
D
CC-33A-5
Suitable for bonding general-purpose gages which are used for general stress
measurement at normal temperature, quick curing.
Request
S
Suitable for bonding general-purpose gages which are used for general stress
measurement at normal temperature, quick curing.
Instantaneous strain gage adhesive cured at normal temperature.
Operating Temperature: -196 .. 120 °C
Metals (Steel, stainless steel, copper, aluminum alloys A1050, A2024, etc.)
Plastics (Acrylate, PVC, nylon, etc.)
Composite materials (CFRP, GFRP, PCB, etc.)
Rubber
5 tubes á 2 grams
S
D
CC-36-5
Instantaneous adhesive cured at normal temperatures for bonding a high-elonation gages
Request
S
Instantaneous adhesive cured at normal temperatures for bonding a high-elonation gages
- Suitable for bonding a high-elonation gage such as KFEM and KFEL at normal temperatures of 20 to 80°C
- Suitable for bonding to hard-to-bond materials such as aluminum alloy (A7075) and magnesium alloy
- High peeling resistance, high impact resistance and less aging deteriotation of bonding strength
- Strong bonding power to hard-to-bond materials
- Curing time is longer than CC-33A
- Operating Temperature: -30 to 100°C
Main material:
- Metals (Steel, stainless steel, copper, aluminum alloys A1050/A2024/A7075, magnesium alloy, etc.)
- Plastics (acrylate, vinyl chloride, nylon, polypropylene, etc.)
- Composite materials (CFRP, GFRP, printed board, etc.)
- Concrete
- Mortar
- Lumber
- Rubber
S