Embedded in resin, the KMP gage measures cure-shrinkage and internal strain.
The compact design enables embedment in shaped resins and is suitable for internal stress measurement of products made by combining
epoxy resin and metal.
Operating temperature range: (Embedment) 20 to 150°C
Materials Resistive element: CuNi alloy foil
Materials Base: Polyimide
Gage resistance: 120 Ohm
Gage factor: approx. 2.0
Length of sensing element: 1mm
Apparent Young's modulus: Approx. 70 GPa (Approx. 7000 kgf/mm²)
Built-in thermocouple: Type K