- Suitable for bonding gages for strain measurement at high temperature.
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Apply pressure (200 to 500 kPa) for 1 hour at 100°C, 2 hours at 200°C and then, heat for 2 hours at the operating temperature with the pressure removed.
If it is difficult to heat to 200°C, "2 hours at 200°C" may be changed to "5 hours at 160°C" with all other conditions followed.
KYOWA ELECTRONIC INSTRUMENTS CO, LTD. is a Japanese company that has been covering all core elements of industrial strain measurement technology since 1951.
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